Introduction of CCGA copper Columns/Solder Columns: With the high speed of communication equipment and the high density of integrated circuits, the traditional ceramic ball grid array (CBGA) is gradually replaced by ceramic column grid array (Ceramic Column Grid Array) because it cannot better adapt to large-size packages (package area ≥ 32mm2). , CCGA) replaced. CCGA package is the development of CBGA package, and it is an adaptive extension. The reason why CBGA shows disadvantages in large-size packages is that it cannot better adapt to the mismatch of the coefficient of thermal expansion (CTE) between the PCB board and the ceramic substrate; while CCGA absorbs and releases internal stress well through a certain micro-deformation and thermal stress, it uses solder solder column/copper column array to replace CBGA's solder ball array.