The next generation of bump technology can achieve higher density, reliability and performance. Copper pillar bumps are widely used in many types of flip-chip interconnects, providing many design advantages and satisfying Current and future ROHS requirements. It is ideal for a variety of applications requiring a combination of small pitch, RoHS/green compliance, low cost, and electro migration performance, such as transceivers, embedded processors, application processors, power management, baseband, ASICs, and SOCs.